Product

4H p-Type

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Current >4H p-Type
P-type SiC substrate materials are mainly used for homoepitaxy and the fabrication of ultrahighvoltage powersemiconductor devices.
They are widely applied in smart grids represented by ultrahighvoltage power transmission,
as well as in rail transit and industrial highpower power supply fields.

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Specifications

6-inch
  • Diameter 150.0mm+0mm/-0.2mm
  • Surface Orientation 4°toward<1120>±0.5°
  • Primary Flat Length 47.5mm±1.5mm
  • Primary Flat Orientation <1120>±5.0°
  • Notch Orientation /
  • Notch Angle /
  • Notch Depth /
  • Thickness 350.0um±25.0um
  • Polytype 4H
  • Type p-type

*Please contact our sales for more detailed information.

>Contact us

Specifications

8-inch
  • Diameter 200.0mm+0mm/-0.2mm
  • Surface Orientation 4°toward<1120>±0.5°
  • Primary Flat Length Notch
  • Primary Flat Orientation /
  • Notch Orientation <1100>±1.0°
  • Notch Angle 90°+5°/-1°
  • Notch Depth 1.0mm+0.25mm/-0mm
  • Thickness 350.0um±25.0um
  • Polytype 4H
  • Type p-type

*Please contact our sales for more detailed information.

>Contact us

Specifications

12-inch
  • Diameter 300.0mm±0.5mm
  • Surface Orientation 4°toward<1120>±0.5°
  • Primary Flat Length Notch
  • Primary Flat Orientation /
  • Notch Orientation <1100>±5.0°
  • Notch Angle 90°+5°/-1°
  • Notch Depth 1.0mm+0.25mm/-0mm
  • Thickness 750.0um±25.0um
  • Polytype 4H
  • Type p-type

RF Devices

By growing GaN epitaxy layer on semi-insulating silicon carbide substrate, silicon carbide based GAN epitaxy wafer can be further made into HEMT and other microwave RF devices, which can be used in information communication, radio detection and other fields.
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